News
PCB industry updates, hardware innovation, and electronics manufacturing trends
North American PCB Book-to-Bill Hits 1.60 in May 2026: AI Infrastructure Drives 102.8% Order Surge
The Global Electronics Association reports North American PCB bookings surged 102.8% year-over-year in May 2026, pushing the book-to-bill ratio to 1.60 — a historic level driven primarily by AI server and data center infrastructure buildout. What this means for PCB supply chains, lead times, and material availability.
Goldman Sachs Forecasts 140% CAGR for AI PCB Market, Raises TAM to $26.6 Billion by 2027
Goldman Sachs dramatically revises AI PCB market projections upward, citing Nvidia's VR200/300 architectural shift from cables to integrated PCBs and rising layer counts that will push mainstream AI server boards beyond 40 layers by 2027.
Isola Acquired by Principal Mineral
Principal Mineral's acquisition of Isola Group and $280M expansion investment consolidates copper foil and copper-clad laminate under one supplier. What this means for PCB fabricators, material lead times, and your next high-frequency board order.
CCL and FR-4 Laminate Prices Rising in Q3 2026
FR-4 and CCL suppliers are signaling Q3 2026 price adjustments as resin costs remain volatile, glass fiber tightens on high-Tg grades, and AI server demand concentrates capacity at the high end. Here is what this means for your multilayer PCB orders and how to protect your project timeline.
China Electronics Manufacturing Profits Surge
China's major electronics manufacturers report a 103.9% year-over-year profit surge in early 2026, driven by AI server demand and export growth. Analysis of how this boom affects PCB supply chain pricing, lead times, and capacity allocation for international customers.
Citi Raises AI-PCB Market Forecast to RMB 562
Citibank's June 2026 report raises its AI-PCB total addressable market forecast significantly, projecting RMB 562 billion by 2028 with 83% year-over-year growth. Analysis of what Google TPU dominance, optical module PCB surges, and capacity constraints mean for PCB buyers and fabricators.
TTM Technologies Acquires Swiss Technology Group
TTM Technologies announces acquisition of Swiss Technology Group AG and ILFA GmbH, establishing its first European manufacturing presence with specialized capabilities in miniaturized medical PCBs, electro-optical boards, and embedded components.
Dongshan Precision (DSBJ) Invests $1.2B in AI
China's Dongshan Precision announces $1.2 billion expansion into AI optical chip and module production through subsidiary Source Photonics. What this means for PCB supply chain capacity and the growing convergence of PCB manufacturing and optical interconnects.
AT&S Invests EUR 2 Billion in Malaysia AI
AT&S announces EUR 1.5-2.0 billion investment in Kulim, Malaysia for AI substrate capacity with AMD partnership. Analysis of supply chain impact, substrate availability timeline, and implications for PCB procurement in 2026-2028.
AT&S Invests EUR2 Billion in Malaysia AI
Austrian IC substrate manufacturer AT&S announces EUR2 billion investment to expand Kulim, Malaysia facility for AI chip packaging. Backed by AMD and Intel commitments, this expansion addresses the global AI substrate bottleneck and signals continued tightening of advanced packaging capacity through 2028.
ACCM Launches Celeritas Negative-CTE PCB Material
Advanced Chip and Circuit Materials (ACCM) announces Celeritas HM50 and HM001 — purpose-built PCB laminates that eliminate warpage and high-frequency signal loss in large-format AI accelerator packages. What this means for high-layer-count board design.
IMS 2026 Wrap-Up
Key RF and microwave PCB technology developments from IEEE IMS 2026 (June 8-13, Boston). Coverage of substrate-integrated waveguide advances, mmWave packaging trends, GaN-on-PCB integration, and what these developments mean for high-frequency board fabrication in 2026-2027.
AI Adoption in PCB Manufacturing Hits Mainstream
New industry data shows 68% of PCB manufacturers have deployed AI in some capacity, yet fewer than 10% have achieved full-scale factory integration. The gap between experimentation and enterprise-wide deployment reveals critical challenges in data quality, talent, and governance that define the next phase of manufacturing competition.
AI in PCB Manufacturing Goes Mainstream
A June 2026 Digitimes report reveals that while AI adoption in PCB manufacturing is now widespread across the industry, fewer than 10% of companies have achieved factory-wide scaled deployments — highlighting the persistent gap between experimentation and production-ready implementation.
IMS 2026 Boston
Key RF PCB technology developments showcased at IEEE IMS 2026 in Boston (June 7-12). New laminate launches, advanced packaging for mmWave, and what it means for RF board designers ordering in 2026.
Chinese-Made PCBs Under AI Chips Raise National
CNBC investigation reveals 60% of global PCBs are made in China — including substrates beneath Nvidia AI accelerators — prompting the U.S. Defense Department to mandate domestic sourcing and Congress to introduce PCB manufacturing incentive legislation amid capacity shortfalls and 40% price surges.
Global PCB Market Hits $112 Billion in 2026 as AI
The world PCB market is on track to reach $112 billion in 2026 — up 14% from $98B in 2025 — with growth concentrated in AI-driven segments: HDI substrates, high-layer-count multilayer, and ABF packaging, according to Contexo/Custer Consulting composite estimates.
North American PCB Orders Climb 25.5% in April
The Global Electronics Association reports April 2026 North American PCB bookings surged 25.5% year-over-year with a book-to-bill ratio of 1.24 — the strongest reading in over a year — signaling expanding production backlogs driven by AI infrastructure and defense demand.
Samsung Electro-Mechanics Evaluates Terahertz
Samsung Electro-Mechanics is piloting terahertz (THz) non-destructive inspection technology with Korean firm Actro to detect microscopic cracks in glass substrates — a key quality challenge as the industry moves toward glass-based semiconductor packaging targeted for 2028 commercialization.
Circuit Technology Center Adds Third Reflow Oven
Circuit Technology Center expands BGA reballing capacity with a third Heller 1707MK7 reflow oven, addressing growing demand for PCB repair and rework services across aerospace, defense, and medical electronics.
India Faces PCB Supply Squeeze as Raw Material
India's PCB industry confronts mounting supply constraints driven by raw material inflation, logistics disruptions, and heavy import dependence, as global AI hardware demand diverts high-end CCL materials away from price-sensitive markets.
PCB Raw Material Prices Surge 40% as AI-Driven
Major CCL suppliers including TUC, Iteq, and Elite Material have issued multiple price increase rounds in H1 2026, with high-end laminates rising 20-40%. The global PCB market officially crosses $100 billion as AI infrastructure spending reshapes material economics.
PCEA June 2026
The June 2026 issue of PCEA Magazine highlights how leading organizations are shifting DFM engagement earlier in the PCB design cycle, with fabrication expertise integrated during layout rather than after release — reducing respins, improving yield, and accelerating time-to-market.
Electroninks Introduces Air-Curable Copper
Austin-based Electroninks announces ambient-atmosphere copper MOD ink that cures at 150°C without inert gas, enabling cost-effective large-area copper metallization for PCB and semiconductor packaging applications.
Indium Corporation Showcases AuLTRA Gold
Indium Corporation highlights its gold-tin preform portfolio at IMS 2026 in Boston, featuring AuLTRA 75 for GaN power amplifier die attach and ultra-thin 8.89µm preforms for high-output laser diode assemblies.
AI-Powered Hardware Prototyping
Startup Itera combines liquid metal reconfigurable circuits with AI-driven design validation to eliminate weeks-long PCB prototype cycles. Backed by $12M from top VCs, the platform signals a new era of software-like iteration speed for hardware engineers.
Itera Raises $12M for Fluid Circuit Board
Deep tech startup Itera emerges from stealth with the world's first fluid circuit board — a glass and liquid metal platform that lets engineers reconfigure circuits in under a minute, eliminating weeks-long PCB prototyping cycles.
GreenSource Fabrication to Showcase Advanced RF
GreenSource Fabrication announces exhibition at IMS 2026 (June 7-13, Boston) featuring advanced RF and microwave PCB manufacturing including PTFE, hybrid stackups, and controlled impedance for defense and 5G/6G applications.
MacDermid Alpha Launches ALPHA OM-377 Solder
MacDermid Alpha introduces OM-377 no-clean solder paste engineered for ultra-fine 008004 component assembly, addressing wetting defects and electrochemical reliability in miniaturized electronics.
PCB East 2026 Attendance Surges 48%
PCEA reports record 48% attendance growth at PCB East 2026 in Worcester. Key themes include AI-driven PCB demand, e-glass supply constraints, and Ultra HDI manufacturing for next-gen computing.
Siemens Xpedition Adds AI Design Reuse and Connected Workflows to Accelerate PCB Development
Siemens announces expanded AI and intelligent automation in Xpedition PCB design platform, combining design reuse with connected data continuity to reduce layout time by 40-60% for complex boards.
AI Edge Devices PCB Market to Hit $67.6 Billion
The global AI edge devices PCB market is projected to surge from $15.4B in 2026 to $67.6B by 2033, driven by NPU-optimized stackups, HDI routing for on-device inference, and thermal management challenges unique to edge AI hardware.
Electroninks Unveils Air-Curable Copper Ink
Electroninks announces a breakthrough copper metal-organic decomposition (MOD) ink that cures in ambient air at 150°C, eliminating the need for nitrogen ovens in additive PCB metallization and enabling cost-effective copper patterning on flexible substrates.
NOTE Inaugurates New Defense EMS Plant in Sweden
Swedish electronics manufacturer NOTE opens a new high-automation facility in Torsby, doubling production capacity for defense and medical electronics manufacturing in Europe's expanding defense industrial base.
San Francisco Circuits Achieves CMMC Level 2
San Francisco Circuits becomes one of the first PCB fabrication suppliers to achieve final CMMC Level 2 certification, meeting 110 NIST cybersecurity controls required for handling Controlled Unclassified Information in the defense industrial base.
American Standard Circuits to Showcase RF and High-Frequency PCB Technologies at IMS 2026 in Boston
American Standard Circuits will exhibit advanced RF, microwave, and millimeter-wave PCB manufacturing capabilities at IEEE IMS 2026, June 8-13 in Boston, highlighting solutions for 5G, aerospace, and defense applications.
Metatron Private Equity Acquires Green Circuits
Reichmann Segal Capital Partners launches Metatron Private Equity and acquires Green Circuits Inc., a Silicon Valley EMS provider serving aerospace, defense, and medical electronics customers.
North American PCB Bookings Surge 25.5% in April
The Global Electronics Association reports April 2026 PCB bookings jumped 25.5% YoY with book-to-bill ratio reaching 1.24, indicating growing production backlog and strong demand heading into H2 2026.
Zhen Ding Joins Nvidia MGX Ecosystem to Supply
Taiwan PCB leader Zhen Ding has joined Nvidia's third-generation MGX modular architecture ecosystem, supplying cable-free PCB-based interconnect technology that eliminates traditional cable assemblies in AI data center server racks.
Aohong Electronics Inaugurates First Overseas PCB
Chinese PCB manufacturer Aohong Electronics officially opens its Thailand subsidiary in Prachinburi Province, marking a major overseas expansion with 1.2 million square meters of annual production capacity serving Southeast Asian and global markets.
Jabil Integrates ViTrox V-ONE AI Digital Factory
Global EMS leader Jabil deploys ViTrox's V-ONE digital factory solution with remote AOI programming and real-time defect analytics, enabling engineers to manage multiple production lines from a centralized control tower.
Jove Enterprise Raises RMB 850M to Expand AI
Shenzhen Jove Enterprise plans to raise up to RMB 850 million through private placement to expand AI PCB manufacturing capacity, targeting high-speed communication boards and AI server power supply PCBs for customers including Delta, Flex, and MPS.
NOTE Inaugurates New EMS Plant in Torsby
Swedish electronics manufacturer NOTE opens a new LEAN-optimized production facility in Torsby, doubling its capacity for defense and medical electronics assembly in response to growing European reshoring demand.
Express Manufacturing Deploys AI-Driven X-Ray
EMS provider Express Manufacturing adds TRI TR7600FB SII AXI system with AI-powered void detection and 5µm resolution, enabling automated defect identification in dense aerospace and medical PCB assemblies.
Intel and 3DGS to Invest $3.3 Billion in Glass
Intel and glass substrate specialist 3DGS sign MoU with Odisha state government for advanced semiconductor substrate factory producing glass core substrates and HDI packaging for AI chips.
Itera Raises $12M for Fluid Circuit Board That
Deep tech startup Itera emerges from stealth with the world's first fluid circuit board using glass and liquid metal, enabling engineers to test and iterate PCB designs in under a minute instead of weeks.
US Senate Introduces Bipartisan Bill with 25% Tax
Senators Gallego and Justice introduce S.4569, the Protecting Circuit Boards and Substrates Act, offering a 25% tax credit for American-made PCBs and a $3 billion grant program to reverse decades of offshoring.
Amphenol Printed Circuits to Showcase
Amphenol Printed Circuits brings phase-matched radar PCB assemblies exceeding 40 inches to IEEE IMS 2026 in Boston, demonstrating large-format capabilities for space, maritime, and terrestrial defense applications.
Taiwan CCL Supplier Eray Tech Signs Pre-Listing
Eray Tech, a Taiwan-based copper clad laminate (CCL) specialist, signs pre-listing counseling with Mega Securities to raise capital for AI server PCB materials and low-earth-orbit satellite applications. The move signals growing demand for ultra-low-loss laminates.
Jabil Deploys ViTrox V-ONE AI Digital Factory
Electronics manufacturing giant Jabil integrates ViTrox's V-ONE AI-powered digital factory solution for centralized AOI programming, real-time defect analytics, and remote manufacturing oversight — marking a milestone in Industry 4.0 adoption for PCB assembly.
Korean PCB Equipment Maker Taesung Lands $4.75M
Taesung Co. secures a KRW 7.1 billion ($4.75M) PCB wet-process equipment contract through its Zhuhai subsidiary, supplying etching and cleaning systems for AI server and FC-BGA substrate production in China.
Aohong Electronics Opens First Overseas PCB
Chinese PCB maker Changzhou Aohong Electronics inaugurates its Thailand manufacturing subsidiary, joining the wave of Chinese electronics firms establishing Southeast Asian production to serve global customers seeking supply chain diversification.
China Launches Glass Circuit Plate Association to Accelerate Domestic TGV and Glass Substrate Technology
The China Glass Circuit Plate Association (GCPA) is officially established at iTGV 2026, uniting upstream and downstream supply chain companies to develop through-glass via (TGV) technology and glass circuit plate manufacturing for AI and advanced packaging applications.
Intel Rio Rancho Targets World's First Mass
Intel Foundry's New Mexico facility moves toward becoming the first factory to mass-produce glass substrates, a critical technology for next-generation AI chip packaging. AWS, Cisco, and reportedly Apple, Google, Nvidia, and Tesla are engaging with the platform.
Jove Enterprise Plans RMB 850 Million Private
Shenzhen Jove Enterprise raises up to USD 125.6M for AI server PCB production expansion. The company targets power supply and high-speed communication PCBs for Delta Electronics, Flex, and MPS, reflecting surging demand for AI infrastructure boards.
The Inference Flip
By mid-2026, AI inference workloads surpass training compute for the first time — driving explosive demand for edge AI PCBs with NPU-optimized stackups, thermal management, and HDI routing that differ fundamentally from data center boards.
Infineon Leads €120M Moore4Power Project
A European consortium led by Infineon has launched Moore4Power — a €120 million research project combining silicon, silicon carbide, and gallium nitride power devices with sensing and communication on heterogeneously integrated substrates.
NAND Flash Production Capacity to Drop 40% in 2026: Impact on PCB-Based Storage and Electronics Supply Chain
Industry estimates show global MLC NAND production capacity declining over 40% in 2026 as fabs transition to 3D NAND, with spot market prices up 300%+ — creating ripple effects across the PCB and electronics assembly supply chain.
NCAB Group Warning
NCAB Group's May 2026 supply chain outlook identifies an emerging jet fuel shortage that could disrupt air freight from Asian PCB factories to Western markets — adding 2-4 weeks to delivery timelines already strained by AI demand.
Itera Unveils 'Fluid Circuit Board' Prototype
Startup Itera demonstrates a working prototype that uses liquid metal and electrowetting to physically reconfigure PCB traces — potentially making hardware iteration 1,000× faster than traditional fabrication cycles.
NCAB Group May 2026 Outlook: News Supply
NCAB Group's quarterly report declares the PCB industry past the point of stable pricing — allocations tightening, lead times extending, and factories fully absorbed by AI-grade production requirements.
PCB East 2026
Conference attendance surged 48% as industry grapples with AI-driven material shortages, power density challenges, and the transformation of PCBs from supporting components to critical performance enablers.
Quilter.ai Project Speedrun
AI layout startup delivers fabricated, booting SBC — the first publicly verified demonstration of autonomous PCB layout producing working hardware with high-speed memory interfaces.
CrossGen AI Launches 'Don't Buy AI
Sean Patterson of CrossGen AI begins a multi-part series in I-Connect007 teaching PCB fabricators how to adopt AI practically — from RFQ review and shift handoffs to CAPA drafting and SOP optimization.
Europe Moves to Strengthen Defence PCB Supply
The European Defence Industry Programme opens funding pathways for PCB and electronics manufacturers to supply critical components for autonomous systems, communications, and defense platforms.
I-Connect007 May 2026
The May 2026 issue of I-Connect007 PCB magazine focuses on how additive processes affect signal integrity — highlighting the convergence of manufacturing innovation and high-speed design requirements.
MacDermid Alpha Positions Direct Metallization as Strategic Enabler for AI and HPC PCB Manufacturing
MacDermid Alpha's May 2026 technical paper argues direct metallization has matured beyond an alternative process to become essential infrastructure for next-generation HDI PCB production serving AI and HPC applications.
ECTC 2026 Opens in Orlando
The 76th IEEE ECTC conference opens May 26 in Orlando with 450+ papers — a record share focused on AI accelerator packaging, hybrid bonding for HBM, and advanced substrates. EVG, Fujifilm, Applied Materials, and Brewer Science showcase technologies enabling next-gen AI hardware.
EV Group Showcases 450nm Pitch Hybrid Bonding and Layer Transfer at ECTC 2026
EV Group (EVG) highlights breakthrough hybrid bonding, IR layer transfer, and maskless lithography technologies at ECTC 2026 — demonstrating 450nm pitch Cu-Cu bonding with 98% yield across 20 million interconnects for next-generation AI chip packaging.
Fujifilm Introduces PFAS-Free PBO Packaging
Fujifilm unveils PFAS-free polybenzoxazole (PBO) photosensitive insulating materials in its ZEMATES product line at ECTC 2026, addressing emerging environmental regulations while meeting advanced semiconductor packaging performance requirements.
PCB West 2026 Registration Opens
PCEA opens registration for PCB West 2026, featuring over 50 technical classes and 120+ hours of in-depth training on PCB design, assembly, and advanced manufacturing — scheduled for September 2026 at the Santa Clara Convention Center.
ECTC 2026: Applied Materials Demonstrates 450nm
IEEE ECTC 2026 in Orlando showcases breakthrough packaging technologies for AI chips. Applied Materials achieves 98% yield across 20 million Cu-Cu hybrid bonds at 450nm pitch, KIOXIA advances 3D flash memory stacking, and AIST demonstrates 6.4 Tbps optical substrate for co-packaged optics.
PCB East 2026 Sets Record Attendance
PCEA's PCB East 2026 conference in Boston saw attendance surge 48% year-over-year, reflecting strong demand for PCB design and manufacturing education amid industry complexity growth. PCB West and PCB Detroit events announced for later in 2026.
PCBSync and Capital Group Launch Major
PCBSync announces strategic partnership with Capital Group to acquire premier PCB and PCBA companies, aiming to build a vertically integrated one-stop EMS platform for AI hardware, robotics, and medical device manufacturing.
U.S. Senate Introduces PCB Reshoring Bill
Senators Gallego and Justice introduce S.4569, the Protecting Circuit Boards and Substrates Act, offering a 25% tax credit for American-made PCBs and a $3 billion grant program. The bill addresses the decline from 30% to 4% U.S. share of global PCB production over three decades.
LEO Satellite Boom Reshapes Global PCB: News Leo
The explosive growth of LEO mega-constellations is creating sustained demand for space-grade PCBs at commercial volumes, forcing fabricators to bridge the gap between aerospace reliability and mass production economics.
Nan Ya PCB Accelerates AI Substrate Capacity as Advanced Packaging Demand Surges
Taiwan's Nan Ya PCB announces capacity expansion for high-end IC substrates targeting AI GPU and HPC applications, driven by NVIDIA and AMD advanced packaging orders that have pushed lead times beyond 16 weeks.
PCB Market Concentrates Around High-Complexity
Industry analysis reveals PCB market growth is increasingly concentrated among fabricators with advanced capabilities in AI infrastructure, HDI, and defense — while smaller shops face mounting pressure from capability gaps.
Taiwan TPCA Launches PCB-Specific AI Knowledge
The Taiwan Printed Circuit Association deploys a specialized AI system trained on decades of PCB manufacturing data, targeting process optimization and knowledge preservation as senior engineers retire.
PCB East 2026 Breaks Attendance Record with 48%
PCEA's PCB East 2026 in Boston saw attendance surge 48% year-over-year as the industry gathers around AI infrastructure demand, advanced materials, and workforce development challenges facing PCB design and fabrication.
Quilter and Siemens Push AI-Driven PCB Design
AI PCB design tools reach production maturity in 2026 as Quilter demonstrates autonomous layout of full computer systems and Siemens integrates AI-powered optimization into Xpedition Standard. EDA market hits $4.2B in Q1 2026 with 20 consecutive quarters of growth.
Samsung 2nm Yield Surpasses 60%
Samsung's 2nm GAA process yield crosses 60% in Q1 2026, up from 20% in late 2025. Combined with HBM4 validation from NVIDIA and AMD, the breakthrough signals intensifying competition in advanced packaging and PCB substrate demand.
TSMC Projects 11× AI Wafer Demand Growth
TSMC raises its AI accelerator wafer forecast to 11× growth from 2022 to 2026, driving unprecedented expansion in CoWoS advanced packaging capacity that directly impacts PCB substrate demand for AI server platforms.
Amphenol to Showcase Large-Format RF and Microwave PCBs at IMS 2026 in Boston
Amphenol Printed Circuits will demonstrate advanced RF/microwave PCB technologies including phase-matched assemblies exceeding 40 inches at IEEE IMS 2026, highlighting growing demand for radar and satellite applications.
Lava International to Invest $114M in Multilayer
Indian smartphone maker Lava International commits $114 million over five years to domestic production of multilayer PCBs, display modules, and camera modules, signaling India's growing role in electronics manufacturing localization.
Samsung Averts Semiconductor Worker Strike as AI
Samsung reached a last-minute bonus agreement with semiconductor workers, avoiding a strike that could have disrupted DRAM and HBM production. The deal ties compensation to AI-driven chip profits, setting a precedent for the industry.
UK Startup siliXon Raises $1.5M to Build AI That
siliXon secured $1.5 million in seed funding to develop AI that creates circuit board designs from natural language descriptions, aiming to democratize hardware design and help Europe localize electronics manufacturing.
Edge AI Technology Report 2026
The Wevolver Edge AI Report 2026, backed by Siemens and industry partners, reveals how edge AI deployment is driving new PCB requirements — from heterogeneous compute architectures to advanced thermal packaging and power-optimized substrates.
PCEA May 2026
The Printed Circuit Engineering Association's May 2026 issue features a landmark article arguing that AI-driven PCB design is shifting from rule-following automation to decision-making systems that interpret design intent and generate constraints dynamically.
SEMICON SEA 2026
SEMICON Southeast Asia 2026 drew over 95 mainland Chinese exhibitors, signaling a major shift from traditional PCB manufacturing toward advanced semiconductor packaging, IC substrates, and AI-driven assembly solutions.
US Laminate Manufacturer Plans Domestic Facility
A major laminate producer announces plans for a new US-based production site focused on high-performance prepreg and laminate materials for mission-critical aerospace, defense, and medical PCB applications, strengthening domestic supply chain resilience.
AI-Powered EDA Tools See 20th Consecutive Quarter
EDA tool revenue for PCB design reached $4.2 billion in Q1 2026, marking 20 straight quarters of growth. AI-native platforms like Quilter claim 10× faster layout while Cadence and Altium integrate ML for DFM and auto-routing, reshaping how engineers design printed circuit boards.
Focus on PCB 2026 Vicenza Concludes with Record
Europe's largest PCB trade fair, Focus on PCB 2026, concluded its fifth edition in Vicenza with 10% more visitors and 155 exhibitors from 17 countries. Key themes included supply chain resilience, AI in manufacturing, and European PCB sovereignty.
LEO Satellite Boom Reshapes Global PCB Supply
The explosive growth of LEO satellite constellations from SpaceX Starlink, Amazon Kuiper, and Chinese operators is creating unprecedented demand for high-reliability, space-grade PCBs. Digitimes reports major shifts in the PCB supply chain as manufacturers race to secure capacity.
PCB Shortage Warning
Reuters and Hackaday report on a new PCB shortage driven by Gulf conflict disrupting petrochemical resin supply to Chinese manufacturers. PCB prices in China have surged 40% with copper foil up 30%, creating the industry's worst supply crunch since COVID-19.
PCB East 2026 Highlights
PCB East 2026 drew 48% more attendees as the industry confronts AI-driven demand for advanced laminates, HDI fabrication capacity, and smart manufacturing — key takeaways for hardware engineers.
Quilter Publishes Project Speedrun Results
Quilter's Project Speedrun demonstrates end-to-end autonomous PCB layout producing a functional computer that boots and runs workloads — marking a milestone for AI-driven hardware design validation.
Global Semiconductor Sales Hit $298.5B in Q1 2026
The Semiconductor Industry Association reports Q1 2026 chip sales reached $298.5 billion, putting the industry on track for its first $1 trillion year. The downstream impact on PCB substrate capacity, advanced packaging, and material demand is already reshaping supply chains.
Siemens Xpedition Standard Adds AI-Powered
Siemens' May 18, 2026 blog details how Xpedition Standard now combines AI-driven schematic entry, intelligent routing automation, design reuse, and Valor manufacturing intelligence for accelerated PCB development.
Doosan Invests ₩180 Billion in Thailand CCL Plant
South Korean materials giant Doosan Corp. will build a new copper-clad laminate factory in Thailand's Araya Industrial Estate, targeting rising demand for high-performance CCL used in AI server and data center PCBs.
Nan Ya PCB Launches Largest-Ever Expansion
Taiwan's Nan Ya PCB Corporation announces record capital expenditure exceeding NT$10 billion for 2026, driven by insatiable demand for ABF IC substrates used in AI GPUs, HPC switches, and next-generation server processors.
NCAB Group May 2026 Outlook
NCAB Group's latest supply chain report confirms the PCB industry has shifted to a seller's market — with AI infrastructure demand, material shortages, and capacity constraints creating the most challenging procurement environment since 2021.
PCB Detroit 2026
PCB Detroit returns to Wayne State University June 15–16 with technical sessions covering RF design, EMI mitigation, thin copper impacts, thermal management, signal integrity, and AI-driven PCB workflows — reflecting the industry's dual focus on advanced materials and intelligent automation.
EDGE Group and ICAPE Sign MoU for PCB Subsystem
UAE defense technology firm EDGE Group and global PCB solutions provider ICAPE Group signed a Memorandum of Understanding at Make it in the Emirates 2026 to explore localized electronic subsystem manufacturing in the UAE, including PCBs, turnkey solutions, and electronic components.
Fac-Tec China 2026
Fac-Tec China 2026, taking place June 2–4 in Shanghai, will bring together 200+ exhibitors across 25,000 m² to showcase smart factory technologies, green manufacturing, and automation solutions for semiconductor, automotive electronics, and PCB manufacturing sectors.
Koh Young Webinar
Koh Young announces a May 20 webinar demonstrating how AI-supported inspection and process optimization improves production resilience, line stability, and delivery capability in SMT manufacturing environments — all while keeping sensitive data on the factory floor.
Siemens Launches Fuse EDA AI Agent
Siemens has announced the Fuse EDA AI Agent, a purpose-built autonomous AI system that plans and orchestrates multi-tool workflows across semiconductor, 3D IC, and PCB system design — from schematic capture through manufacturing sign-off. The system integrates with NVIDIA Agent Toolkit and Nemotron models.
Infineon Launches 2300V CoolSiC MOSFET Power
Infineon expands XHP 2 power module range with 2300V SiC MOSFETs supporting 1500V DC-link voltages for wind, solar, and battery storage converters — achieving 300 kW/L power density in demo systems.
Koh Young to Showcase AI-Powered AOI and SPI
Koh Young brings Smart AI inspection ecosystem — including KAP Auto Programming, Smart Review, KSMART analytics, and KPO process optimization — to Mexico's Ciudad Juárez electronics manufacturing hub on May 21.
Mobile DRAM Prices Surge 78% in Q2 2026 as Memory
TrendForce reports LPDDR5X prices rising 78-83% quarter-on-quarter in Q2 2026, forcing smartphone vendors to cut production plans and downgrade memory configurations — with ripple effects across the entire electronics bill of materials.
Indium Corporation to Present Solder TIM Research
Indium Corporation will present research on fluxless vacuum formic acid reflow of indium-based solder thermal interface materials (sTIMs) at IEEE ECTC 2026, addressing next-generation AI and HPC thermal dissipation challenges with 86 W/mK thermal conductivity solutions.
NEPCON Asia 2026 Expands to 90,000 m² in Shenzhen
NEPCON Asia 2026, set for October 27-29 in Shenzhen, expands to 90,000 m² with new ROBOTECH Asia co-event. The exhibition targets AI hardware, automotive electronics, and semiconductor packaging supply chains, expecting 170,000+ visitors across the combined event ecosystem.
TSMC Plans 70% CAGR for 2nm and A16 Capacity
At its Taiwan Technology Symposium, TSMC announced aggressive capacity expansion for 2nm and A16 nodes at 70% CAGR from 2026-2028, with CoWoS advanced packaging growing over 80% CAGR. Nine new fabs and packaging plants planned for 2026 across Taiwan, Arizona, Japan, and Germany.
ASMPT Launches Closed-Loop Nozzle Management
ASMPT's new factory-wide nozzle management system uses RFID tracking, automated cleaning, and predictive maintenance to eliminate placement defects caused by worn or contaminated pick-and-place nozzles in high-volume SMT production.
Focus on PCB 2026 Opens in Vicenza
Europe's leading PCB trade fair draws 150+ exhibitors to address raw material costs, AI-driven manufacturing, and strategic supply chain diversification as the continent pushes for electronics sovereignty.
SMIC Reports Surge in Specialty Chip Orders as Global Fabs Pivot to AI and HBM — PCB Substrate Demand Follows
China's largest foundry sees order influx for standard and specialty processes as TSMC, Samsung, and Intel shift capacity to AI chips, creating downstream PCB substrate demand for power management, analog, and automotive ICs.
Ajinomoto Raises ABF Substrate Film Prices 30% as AI Demand Extends Supply Gap to 2027
Ajinomoto announces 30% price hike for ABF build-up film effective Q3 2026. Supply-demand imbalance for AI server substrates expected to persist through end of 2027, with substrate makers operating at full capacity.
Global Semiconductor Industry on Track for $975
Deloitte forecasts semiconductor sales reaching $975 billion in 2026 with 26% growth. The AI infrastructure boom creates unprecedented demand for advanced PCBs, substrates, and high-layer-count boards used in data center networking.
Semiconductor Materials Market Hits Record $73.2
SEMI reports global semiconductor materials revenue grew 6.8% YoY to $73.2 billion in 2025, with packaging materials up 9.3% as advanced substrate and bonding wire demand surges. Taiwan leads at $21.7B for 16th consecutive year.
Molex Completes $430M Acquisition of Teramount
Molex finalizes acquisition of silicon photonics startup Teramount for co-packaged optics. The deal brings detachable fiber-to-chip coupling technology to high-volume AI datacenter interconnects.
Semiconductor Industry on Track for $1 Trillion
Global chip sales reached $298.5B in Q1 2026, the strongest quarterly growth in 70 years. SIA, IDC, and Future Horizons all project the semiconductor market will pass $1 trillion this year, with massive implications for PCB substrate and packaging demand.
SIA and 17 Business Groups Urge Congress to Extend Semiconductor Manufacturing Tax Credit Before Year-End Expiry
A coalition of 18 trade groups led by the Semiconductor Industry Association calls on Congress to extend and expand the Advanced Manufacturing Investment Credit (AMIC) for chip production, currently set to expire at the end of 2026.
Focus on PCB 2026
Europe's premier PCB trade show showcases AI-driven SMT inspection, automated defect monitoring for 3D-printed electronics, and intelligent quoting systems transforming factory operations.
Glass Substrates vs Organic PCB Packaging
Intel and Samsung accelerate glass-core substrate production for AI chip packaging, challenging organic ABF materials with near-silicon CTE matching and sub-2-micron interconnects.
S&P Global
Corporate earnings call analysis reveals semiconductor supply chain sentiment has slumped to multi-year lows, driven by AI demand concentration, reshoring disruptions, and raw material constraints.
Japan Power Semiconductor Mega-Merger
Three Japanese semiconductor giants sign MoU to merge their power chip divisions, creating the world's second-largest power semiconductor supplier. The consolidation signals intensifying competition in SiC and GaN devices that directly impact PCB thermal design requirements.
Global Chip Sales Hit $298.5 Billion in Q1 2026
SIA reports Q1 2026 semiconductor sales reached $298.5 billion with March alone at $99.5B — a 79.2% year-over-year increase. The industry is on track to exceed $1 trillion in annual revenue for the first time, with massive implications for PCB fabrication capacity and material supply.
Taiwan PCB Makers Race to Secure Second-Source
Taiwan's PCB supply chain is aggressively diversifying CCL and laminate suppliers as AI server demand drives the global copper-clad laminate market into allocation mode. With the market projected to reach $95.8 billion in 2026, material security has become a strategic priority.
CCL Market Tightens as Korea Import Prices Surge
South Korea's CCL import prices hit an unprecedented $20,728 per ton in March 2026, up 74.5% year-over-year. Kingboard issues its fourth price hike of 2026, while EMC and TUC ramp capacity. The NVIDIA Rubin GPU is reshaping demand for advanced substrates and PCB materials.
SMTA Capital Expo 2026
At SMTA Capital Expo in Baltimore, TTCI showcases X-ray and CT inspection capabilities alongside traditional electrical test, highlighting the growing need for non-destructive internal analysis as PCB assemblies grow denser and more complex.
TSMC Pushes CoPoS Exclusivity to Lock In Next-Gen
TSMC accelerates panel-level CoPoS packaging development with strict confidentiality controls while ramping CoWoS capacity to 115,000-140,000 wafers per month by end of 2026. The advanced packaging race intensifies as AI chip demand outstrips available capacity across the industry.
ASE, Samsung, and Amkor Accelerate Packaging
The global semiconductor packaging and testing sector enters its most aggressive expansion phase as ASE breaks ground on six new facilities worldwide, Samsung commits $4B to Vietnam, and Amkor scales its Southeast Asian operations to meet AI-driven demand.
Electronics Manufacturing Shifts to Vietnam
Lithuania-based TLT Manufacturing opens its new Vietnam electronics facility, joining a wave of EMS companies establishing dual-region operations in Southeast Asia. The trend reflects ongoing supply chain diversification away from single-geography concentration.
YieldWerx and WATS Partner to Bridge PCB Test
Norway-based WATS and yieldWerx announce a partnership connecting PCBA test data with wafer and chip-level manufacturing analytics, enabling cross-stage yield correlation for photonics, advanced packaging, and high-density integration environments.
Global Semiconductor Sales Hit $298.5 Billion in Q1 2026 — Industry on Track for $1 Trillion Year
SIA reports worldwide chip sales surged 25% quarter-over-quarter to $298.5B in Q1 2026, with March alone reaching $99.5B — a 79.2% year-over-year increase signaling unprecedented demand for PCB substrates and advanced packaging.
Kyocera Unveils Multilayer Ceramic Core Substrate
Kyocera announces a breakthrough multilayer ceramic core substrate offering superior rigidity and circuit miniaturization for next-gen AI chips, addressing warpage challenges in large 2.5D packages for data centers and ASICs.
NCAB Group PCB Supply Chain Outlook May 2026
NCAB Group's May 2026 PCB supply chain outlook warns of an accelerating seller's market with copper above $13,300/t, glass fiber quotas, and 40-week MCU lead times forcing procurement teams to rethink strategies.
ABF Substrate Market Hits $7.19 Billion as Advanced Packaging Drives PCB Substrate Boom in 2026
The global ABF substrate market reaches $7.19 billion while substrate-like PCB demand surges to $4.24 billion in 2026. Advanced semiconductor packaging is reshaping PCB manufacturing requirements as chiplets and 2.5D/3D integration demand unprecedented interconnect density.
PCB East 2026 Attendance Surges 48%: News Percent
PCB East 2026 conference and exhibition attendance rose nearly 48% year-over-year, with 85+ exhibitors and expanded venue reflecting booming demand for PCB design, fabrication, and assembly services in 2026.
Siemens Wins Chiplet Summit 2026 Best of Show for 3D IC Packaging Design — EDA Tools Reshape PCB-Package Co-Design
Siemens EDA wins 'Packaging: Design' Best of Show at Chiplet Summit 2026 for Innovator3D IC, a unified flow for heterogeneous chiplet integration across 2.5D/3D packaging. The award signals growing EDA investment in PCB-package co-design as multi-die systems demand end-to-end design continuity.
World's First Embodied AI Robots Deployed on Consumer Electronics Production Lines — AGIBOT G2 Achieves 99.9% Success Rate
AGIBOT and Longcheer Technology have deployed embodied AI robots on live tablet manufacturing lines, marking the first large-scale industrial implementation of autonomous robots in consumer electronics precision manufacturing with 310 UPH throughput.
PCB Supply Chain Crisis Deepens
The global PCB supply chain faces its most severe disruption since COVID-19 as the Iran-Saudi conflict drives material shortages. Copper foil up 30%, epoxy resin lead times at 15 weeks, and PCB prices surging 40% in April alone. NCAB Group's May 2026 outlook warns of sustained constraints through H2.
Samsung 2nm Yields Reach 55% as Gate-All-Around
Samsung's 2nm GAA process yields have improved from 20-30% to 55%, signaling imminent mass production for AI and mobile chips. The advancement drives new PCB substrate requirements including ultra-fine-line IC substrates and advanced packaging interposers.
AI-Driven PCB Design Tools See 20th Consecutive
EDA tool revenue for PCB design reached $4.2 billion in Q1 2026, marking 20 straight quarters of growth. AI-native platforms like Quilter claim 10× faster time-to-layout while traditional leaders Cadence and Altium integrate machine learning for DFM optimization, auto-routing, and signal integrity prediction.
Semiconductor Supply Chain Bottlenecks Persist
Moody's new analysis reveals that semiconductor supply chain constraints are shifting from fab capacity to upstream materials—including PCB substrates, specialty chemicals, and packaging materials—potentially capping chip delivery growth at 15-20% below demand through 2027.
PCB Resin Crisis Deepens
Six weeks after the SABIC Jubail plant attack disrupted 70% of global high-purity PPE resin supply, PCB laminate manufacturers report dwindling inventory and accelerating price increases. Industry sources indicate alternative suppliers may need 6-9 months to qualify and scale production.
PCB Design Tool Sales Hit 20 Consecutive Quarters
The PCB and MCM design tool market recorded its 20th straight quarter of year-over-year growth, reaching a record $484.6 million in Q4 2025. The broader EDA industry hit $5.5 billion, reflecting sustained complexity-driven demand for board-level design automation.
PCB Prices Surge 40% as Iran Conflict Disrupts
The Iran-Saudi Arabia conflict has triggered the most severe PCB supply chain disruption since COVID-19, with prices soaring 40% in April after SABIC's Jubail petrochemical complex — supplier of 70% of global high-purity PPE resin — was forced offline.
Global Semiconductor Revenue to Exceed $1.3
Gartner projects global semiconductor revenue will surpass $1.3 trillion in 2026 — a 64% increase and the highest growth rate in two decades. DRAM prices alone are forecast to rise 125%, driving unprecedented demand for high-layer-count PCBs and advanced substrates.
6G Research Drives Millimeter-Wave PCB Material
Early 6G research initiatives are creating demand for specialized PCB materials operating at 100-300 GHz frequencies. Ultra-low loss substrates and glass core technologies emerge as critical enablers.
Advanced Packaging Drives PCB Substrate
As chiplet architectures and advanced packaging reshape semiconductor design, the boundary between IC substrate and PCB is blurring. Here's what it means for PCB engineers and manufacturers.
Antenna-in-Package Technology Drives PCB
Antenna-in-Package (AiP) technology is revolutionizing PCB design by integrating antennas directly into semiconductor packages. This trend reduces board space requirements by up to 60% while improving RF performance.
Automotive Electrification Drives High-Voltage
The automotive industry's shift to 800V electrical architectures is driving evolution in PCB design standards. New IPC guidelines address creepage, clearance, and material requirements for high-voltage automotive applications.
PCB Market to Reach $182 Billion by 2036 as LPKF
The global PCB and PCBA market is projected to grow at 5.1% CAGR reaching $182.2 billion by 2036, while LPKF demonstrates rapid prototyping capabilities that could reshape how engineers approach early-stage PCB development.
Semiconductor Price Hikes Hit PCB Supply Chain
Major semiconductor suppliers including STMicroelectronics, NXP, Texas Instruments, Infineon, and onsemi have announced price increases effective April-May 2026, citing material, energy, and logistics cost pressures.
Your Next Hardware Project Just Got Harder
A perfect storm of supply shocks, soaring material costs, and a tectonic shift toward AI-driven design is rewriting the rules for hardware creators. Here's what every innovator building the next big thing needs to know.
Next-Gen AI Servers Are Pushing PCB Technology
AI GPU clusters and networking switches demand sub-50μm traces, any-layer microvias, and 20+ layers — driving a manufacturing revolution in PCB fabrication.
India's PLI Scheme Is Reshaping Global PCB
India's Production Linked Incentive scheme is attracting billions in PCB manufacturing investment, accelerating China+1 supply chain diversification.
PFAS Restriction Proposals Are Coming for PCB
EU and US PFAS restrictions will impact PCB solder masks, conformal coatings, and flux. Here's the timeline, affected materials, and alternatives.
6G Terahertz PCB Materials
New low-loss PCB materials targeting sub-THz frequencies (100-300 GHz) emerge from university and industry labs, laying groundwork for 6G wireless infrastructure boards.
AI Memory Squeeze Reshapes PCB Demand
AI workloads are consuming an outsized share of global memory production, creating supply constraints that ripple through PCB manufacturing for consumer, automotive, and industrial electronics.
Japan's METI Announces ¥300 Billion Subsidy
Japan's Ministry of Economy allocates ¥300B to bolster domestic PCB substrate manufacturing, targeting advanced packaging and semiconductor supply chain resilience.
Medical Device PCB Traceability
Updated FDA UDI rules and EU MDR enforcement are driving full PCB-level traceability in medical devices, requiring lot tracking, serialization, and digital documentation.
US Defense PCB Supplier Base Hits Critical Low
A Pentagon industrial base assessment reveals the US domestic PCB supplier base has shrunk to fewer than 150 qualified fabricators, threatening defense electronics readiness.
Apple's iPhone 18 Expected to Push Any-Layer HDI
Supply chain intelligence indicates Apple's iPhone 18 may adopt a 12-layer any-layer HDI mainboard — the most complex smartphone PCB ever produced at scale. The implications for HDI manufacturing capacity, process technology, and the broader PCB industry are substantial.
EU Launches New Incentives to Reshore PCB
The European Union expands its Chips Act framework to include PCB fabrication subsidies, signaling a major push to rebuild domestic printed circuit board manufacturing capacity.
800V EV Architectures Drive New PCB Thermal and Insulation Design Requirements
The automotive industry's rapid adoption of 800V electrical architectures for EVs is creating demanding new requirements for PCB designers: higher creepage and clearance distances, reinforced insulation materials, heavy copper for high-current paths, and advanced thermal management for SiC power electronics.
IPC J-STD-001 Revision H Takes Effect
The latest revision of IPC J-STD-001, the industry's most widely referenced soldering standard, introduces significant updates for fine-pitch assembly, BGA void acceptance, selective soldering, and flux residue management. Here's what PCB designers and manufacturers need to know.
Keysight Advances PCB Signal Integrity Testing
Keysight Technologies unveils an AI-driven signal integrity testing platform that automates high-speed PCB validation, reducing compliance testing time by up to 60%.
IPC Study Reveals New Insights on Lead-Free
A comprehensive IPC research program delivers critical findings on SAC305 solder joint performance under extended thermal cycling, with major implications for automotive and aerospace PCB assemblies.
mSAP Process Gains Traction Beyond Smartphones
The modified Semi-Additive Process (mSAP), once exclusive to premium smartphone mainboards, is breaking into automotive ADAS and AI server applications. This shift is reshaping PCB manufacturing capabilities, supply chains, and design rules across the industry.
Samsung's 2nm GAA Process Enters Risk Production
Samsung Foundry's SF2 process node marks the industry's transition to Gate-All-Around transistor architecture at 2nm. Higher transistor density means more chip I/Os, finer-pitch packaging, and cascading challenges for PCB substrate and board-level design.
SpaceX Starlink Expansion Drives Unprecedented
SpaceX's accelerated Starlink constellation deployment is creating massive demand for space-grade printed circuit boards, reshaping the high-reliability PCB supply chain.
Vietnam Emerges as Major PCB Manufacturing Hub
Vietnam is rapidly becoming a major player in global PCB manufacturing, with over $2 billion in committed investments from domestic and international fabricators driving the China+1 diversification strategy.
AI-Driven PCB Design Tools Gain Traction
Major EDA vendors are embedding machine learning into PCB design workflows. From ML-assisted auto-routing to automated DFM violation detection, here's what's changing — and what experienced engineers should know.
Copper Foil Prices Surge 15% in Q1 2026
LME copper prices hit multi-year highs in early 2026, driving electrodeposited copper foil costs up 15%. Here's what it means for PCB manufacturers, designers, and procurement teams — and how to mitigate the impact.
Copper Prices Hit Record Highs in Q2 2026
LME copper prices have breached $12,000/ton in Q2 2026, significantly impacting PCB manufacturing costs. Analysis of pricing trends, heavy copper impacts, and supply chain strategies.
DDR5 Memory PCB Design Challenges
DDR5 memory's leap to 4800 MT/s and beyond demands new PCB design strategies for signal integrity, trace routing, and material selection. Here's what designers need to know.
Flexible PCB Demand Surges as Wearable Medical
Continuous glucose monitors, ECG patches, and smart drug delivery systems are driving unprecedented demand for advanced flexible PCB designs as wearable medical devices hit mass production.
Global PCB Market Shifts
New PCB factories in Thailand, Vietnam, and Malaysia signal a structural shift in global production as OEMs pursue supply chain diversification — but China's dominance remains formidable.
IPC Releases Updated IPC-6012F Standard with Stricter Reliability Requirements for Automotive PCBs
The IPC's latest revision to its rigid PCB qualification standard introduces tighter via reliability metrics, enhanced IST requirements, and new Class 3/A provisions that will reshape automotive PCB manufacturing.
US Defense Budget 2026 Boosts ITAR-Compliant PCB
The 2026 US defense budget increase is driving strong demand for ITAR-compliant PCB manufacturing. Reshoring trends and military-grade requirements create opportunities for domestic fabricators.
New Low-Loss PCB Laminates for 5G mmWave
The latest generation of ultra-low-loss laminates from Panasonic and AGC is redefining what's possible for 5G mmWave and 77GHz automotive radar PCBs, with dissipation factors breaking the 0.001 barrier.
TSMC CoWoS and InFO Driving PCB-Substrate
TSMC's advanced packaging technologies are blurring the boundary between IC substrates and PCBs. As L/S requirements approach 5/5 μm, PCB manufacturers must adapt or risk obsolescence.
AI-Powered PCB Design Tools Reshape Engineering
Cadence, Siemens EDA, and startups deploy AI/ML tools for PCB auto-routing and DFM, cutting design cycles by 30-50%.
IPC-1752B Update Adds PFAS Reporting Requirements
Updated IPC-1752B material declaration standard adds PFAS substance reporting aligned with EU REACH/RoHS regulatory changes.
NVIDIA GB300 NVL72 Drives Substrate-Like PCB
NVIDIA's GB300 NVL72 server rack pushes PCB substrate technology to its limits with sub-50µm features and ultra-HDI requirements.
EU Circular Economy Rules Impact PCB Recycling
New EU ESPR regulations set recyclability and recycled content targets for electronics, directly affecting PCB design and end-of-life.
Samsung Expands ABF Substrate for AI Chips
Samsung Electro-Mechanics invests $1.2B in ABF substrate capacity to meet surging AI chip packaging demand from NVIDIA and AMD.
Data Center PCB Demand Surges as 16+ Layer Boards
AI-driven data center construction is creating unprecedented demand for high-layer-count PCBs. Lead times for 16+ layer boards have extended significantly in Q2 2026, with GPU server and network switch platforms driving the supply squeeze.
EU Chips Act Drives PCB Manufacturing Expansion
The European Chips Act's €43 billion investment is reshaping the continent's semiconductor landscape — and creating unprecedented demand for local PCB manufacturing capacity in HDI, advanced multilayer, and substrate technologies.
Glass Core Substrates
Major semiconductor companies are advancing glass core substrate technology for next-generation AI chip packaging, promising superior signal integrity and higher interconnect density. Here's what this shift means for the broader PCB manufacturing ecosystem.
IPC-6012 Revision ES Update
The upcoming IPC-6012 Revision ES introduces significantly tighter requirements for via fill quality, copper plating uniformity, and hole wall integrity. Here's what PCB engineers and manufacturers need to know about the changes and their impact on HDI and high-reliability board production.
IPC-CFX Standard Gains Momentum
IPC Connected Factory Exchange (IPC-CFX / IPC-2591) adoption is accelerating in PCB fabrication plants, enabling real-time machine-to-machine data exchange and full lot traceability — a game-changer for aerospace, medical, and automotive Class 3 board quality.
New Ultra-Low-Loss PCB Laminates Target Sub-6 GHz
Material manufacturers are releasing next-generation ultra-low-loss laminates with Df below 0.002 at 10 GHz, reshaping the competitive landscape for 5G base station and phased array antenna PCB fabrication.
PCIe Gen 6.0 Finalization Brings New PCB Design
The PCIe 6.0 specification pushes data rates to 64 GT/s with PAM4 encoding, imposing stringent new requirements on PCB materials, via design, trace geometry, and signal integrity that will reshape server and GPU interconnect board design.
Substrate-Like PCB (SLP) Technology Expands
SLP technology with line/space below 30/30 μm using modified semi-additive process (mSAP) is moving beyond smartphone main boards into automotive ADAS, IoT edge computing, and wearable medical devices — bridging the gap between traditional PCB and IC substrate.
New Scope 3 Emissions Reporting Guidance Targets
The Global Electronics Association and RBA have released joint guidance to help electronics companies measure and report Scope 3.1 purchased goods emissions — a category where fewer than half of companies currently disclose data. Here's what PCB buyers and manufacturers need to know.
US PCB Tariff Impact April 2026
Escalating US tariffs on Chinese-manufactured PCBs and electronic components are reshaping global supply chains in Q2 2026. Engineers and procurement teams face tough decisions as reshoring gains momentum and the 'China Plus One' strategy becomes the new baseline.
AGC Launches Advanced RF PCB Materials for 77 GHz
AGC introduces fastRise low-loss prepreg for automotive radar applications, expanding North American sourcing options for high-frequency PCB materials.
APEX EXPO 2026: News Advanced
Key takeaways from APEX EXPO 2026 — AI infrastructure is driving unprecedented demand for HDI and high-layer-count PCBs, while quantum computing and heterogeneous integration open new frontiers.
IBM Quantum Computing Push Creates New Requirements for PCB Supply Chain
As IBM moves quantum computers from labs to real-world installations, the electronics supply chain faces novel demands for cryogenic-compatible PCBs and ultra-low-noise interconnects.
PCB Forge: New Open-Source Tool Enables
A new open-source tool called PCB Forge lets makers create functional PCBs using 3D printers and copper tape — no chemicals required. Here's what it means for prototyping.
Volatile Metals Market Creates PCB Pricing
Precious metals volatility — gold up 60%, silver 120%, copper 35% — is reshaping PCB manufacturing costs and forcing the industry to adapt procurement strategies.
Advanced Packaging Revolution
The shift to chiplet-based architectures and 2.5D/3D packaging is creating new demands for PCB substrates, blurring the boundary between traditional PCBs and semiconductor packaging with implications for materials, design rules, and manufacturing processes.
AI and ML Hardware Driving Unprecedented Demand
The explosive growth of AI/ML training and inference hardware is pushing PCB layer counts to new extremes, with 40-68 layer boards becoming standard for next-generation GPU and ASIC platforms.
Automotive Electronics Reliability Requirements
Evolving automotive safety standards and the proliferation of ADAS, EV power electronics, and autonomous driving systems are driving stricter PCB reliability requirements, with implications for materials, testing, and manufacturing processes.
IPC Standards Updates for 2026
A roundup of key IPC standards updates in 2026, including revisions to IPC-6012, IPC-2581, and new standards addressing advanced packaging, microvia reliability, and sustainability requirements.
RF and 5G Infrastructure Buildout Fuels Surging
The global 5G infrastructure rollout and emerging 5G-Advanced deployments are driving strong demand for high-frequency PCBs on specialty substrates, creating opportunities and challenges for PCB manufacturers.
Artemis II Validates Rad-Hard Electronics in Deep
NASA's Artemis II mission confirmed that radiation-hardened semiconductors performed flawlessly beyond Earth orbit. Here's why PCB reliability standards matter more than ever for aerospace applications.
China's Chip Equipment Makers Hit Record Revenue
Chinese semiconductor equipment suppliers posted record 2025 revenues as domestic fabs expanded capacity. What this means for PCB fabrication capacity, material sourcing, and global supply chains.
APEX EXPO 2026
Key takeaways from the Global Electronics Association's APEX EXPO 2026 — from AI-driven manufacturing to heterogeneous integration and the evolving role of PCBs in advanced packaging.