Artemis II Validates Rad-Hard Electronics in Deep

NASA’s Artemis II crew returned safely on April 14 after a ten-day journey beyond Earth orbit — the farthest humans have traveled since Apollo 17 in 1972. While the mission made headlines for its crewed lunar flyby, the electronics story is equally significant for the PCB industry.

Infineon’s Rad-Hard Components Performed Flawlessly

Infineon reported that its radiation-hardened semiconductors operated without fault throughout the mission, supporting power management, control, and data communication within the Orion capsule. The components, developed by Infineon’s IR HiRel division, are qualified to MIL-PRF-38535 Class V and ESA ESCC standards.

The company also highlighted its space-qualified 100V GaN transistor — a sign that wide-bandgap semiconductors are moving from terrestrial power electronics into orbit, where their lower switching losses and higher power density translate directly into weight savings.

Why This Matters for PCB Manufacturing

Radiation-hardened electronics are only as reliable as the boards they’re mounted on. Deep-space missions subject PCBs to:

• Thermal cycling from −150°C to +120°C as the spacecraft moves between sunlight and shadow
• High-energy particle bombardment that can cause copper migration and dielectric breakdown
• Vibration and mechanical stress during launch (up to 6g sustained acceleration)
• Zero-maintenance lifetime — you cannot rework a board in orbit

This is why aerospace PCBs are manufactured to IPC Class 3 standards with additional requirements: controlled impedance, via fill and cap plating, rigorous cross-section analysis, and full traceability from laminate lot to finished board.

The Growing Aerospace PCB Market

With Artemis, SpaceX Starship, and the expanding satellite constellation market (OneWeb, Starlink, Kuiper), demand for high-reliability PCBs is accelerating. These applications increasingly require:

• High layer count boards (16-40+ layers) for complex avionics systems
• Rogers and PTFE materials for RF communication and radar subsystems
• HDI with sequential lamination for miniaturized sensor packages
• Controlled impedance with TDR verification on every production panel

The trend is clear: as missions get more ambitious, the PCB reliability requirements get more demanding.

AtlasPCB manufactures to IPC Class 3 standards with full engineering pre-audit. If you’re designing for aerospace or high-reliability applications, upload your files for a free DFM review.